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課程名稱 |
高科技廠房設施設計
HIGH-TECH FACILITY DESIGN |
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開課學期 |
97-1 |
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授課對象 |
工學院 營建工程與管理組 |
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授課教師 |
張陸滿 |
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課號 |
CIE5065 |
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課程識別碼 |
521 U3790 |
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班次 |
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學分 |
3 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期三A,B,C(18:25~21:05) |
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上課地點 |
土220 |
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備註 |
上課時間: 18:45-21:45
總人數上限：30人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/971hightech_class |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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課程概述 |
Purpose:
The purpose of this course is to provide basic design knowledge needed for cleanroom facilities that supplement high-tech manufacturing and R&D. High-Tech includes, not limited to, the advanced technologies applied in the fields of microelectronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The processes undertaken in high-tech manufacturing plants and R&D labs require cleanrooms with extremely stringent environmental control. |
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課程目標 |
Objectives: The course will enable the students to:
1. Differentiate the typical processes in semiconductor, biotech, medical
devices, and pharmaceutical manufacturing and R&D.
2. Explain the interdisciplinary nature of high tech manufacturing and research
3. Perform architectural design for cleanroom and schematically layout factory.
4. Use the basic theories and principles to design systems for heating, ventilation and air conditioning (HVAC,) water/air treatment, noise and vibration mitigation.
5. Classify cleanrooms in terms of various international standards.
6. Specify the environmental control criteria for cleanroom in terms of temperature and humidity level, air/water quality, purity of chemicals and gases, noise and vibration degree, electromagnetic and radio frequency interference, electrostatic discharge, materials outgassing, and safe grounding.
7. Apply the knowledge in testing and commissioning cleanroom and its associated facilities.
8. Establish contamination control programs for constructing, operating, and maintaining the high-tech facilities.
9. Address the issues in automatically managing the emergency, safety, and security systems.
10. Link to the information sources for further studies in nano/micro fabrication and research.
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課程要求 |
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預期每週課後學習時數 |
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Office Hours |
另約時間 |
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指定閱讀 |
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參考書目 |
1. Chang, C.Y., and Sze, S.M.,ULSI Technology, McGraw-HillCompany, Inc.,
International
Edition, 1996, New York.
2. Food and Drug Administration, Guideline on
Sterile Drug Products Produced by Aseptic Processing, FDA,Information Branch,
Rockville,
Maryland, USA.
3. International Organization for Standards, ISO Standard 14644-4, part 4: Design,
Construction, Start up,Geneva, Switzerland, 1999.
4. International Society of Pharmaceutical Engineering,Pharmaceutical
Engineering Guide – A Guide for New Facilities, Volume 3: SterileManufacturing
Facilities,ISPE, 2000.
5. Lurgi, S., Xu, J., and Zaslavsky, A., Future Trends in Microelectronics,
Wiley, N.Y, 1999.
6. Mulhall, D., Our Molecular Future: How Nanotechnology, Robotics, Genetics,
and Artificial Intelligence Will Transform Our World, Prometheus Books,
Amherst,N.Y., 2002.
7. Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor
Manufacturing
Technology, Marcel Dekker, New York, 2000.
8. Scherge, M., Biological Micro- and Nanotribiology: Nature’s Solutions,
Sprinker,New York, 2001.
9. Van Zant, Peter, Microchip Fabrication: A Practical Guide to Semiconductor
Processing,
4th ed., McGraw-Hill, New York, 2000.
10. Whyte. W., Cleanroom Technology: Fundamentals of Design, Testing, and Operation
Operation, Chichester, New York, 2001.
11. 半導體製造技術，QuirkSerda 著，羅文雄、蔡榮輝 譯，滄海（2003）
12. 半導體奈米技術，龍文安著，五南(2006)
13. 半導體英語，傳田精一 著，陳連春 譯，建興(2003)
14. 高科技廠務，顏登通，全華科技(2008)
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
期末考 |
15% |
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2. |
課堂參與 |
10% |
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3. |
作業 |
25% |
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4. |
期末報告 |
50% |
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週次 |
日期 |
單元主題 |
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第1週 |
9/17 |
Course Introduction
Nanotechnology Bases and Manufacturing |
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第2週 |
9/24 |
Integrated Circuit Manufacturing Processes and Cleanroom |
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第3週 |
10/01 |
Nano Manufacturing Fab, Milestones, and Construction Protocols |
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第4週 |
10/08 |
NEMS Processes and NTU Nanotech Lab Tour |
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第5週 |
10/15 |
High Performance Microscope and EMC |
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第6週 |
10/22 |
Fundamental of Structure Stability, Sound & Mitigation
(本週演講主題) |
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第7週 |
10/29 |
Fundamentals of Vibration, Sound & Mitigation |
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第8週 |
11/05 |
HVAC Design |
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第9週 |
11/12 |
No Mid-term Exam and No Class, Compensation for Field Trips |
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第10週 |
11/19 |
High-Tech Facility for Semiconductor and FPD Equipment |
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第11週 |
11/26 |
Electrical Systems and Power Stability
in High-Tech Facilities
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第12週 |
12/03 |
Emerging Contaminants in Water Recycling/Reuse |
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第13週 |
12/10 |
Airborne Molecular Contamination |
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第14週 |
12/17 |
Wafer Manufacturing Tools, Tool-Up, and Piping Contamination Control |
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第15週 |
12/24 |
Green Fab & LEED |
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第16週 |
12/31 |
Compensation for Field Trip on 12/20 |
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第17週 |
1/07 |
Term Project Presentation |
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第11-2週 |
2008/11/29 |
Field Trip to Ruentex Construction Sites on Yangmei & Zunan, Saturday, 6~8 hours |
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第14-2週 |
2008/12/20 |
Field Trip to TSMC Fab in Hsin-Zu （6 hours） |
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第17-2週 |
2009/01/14 |
期末考試 take home 演講資料
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